昆山Automatic silicon wafer invisible cutting equipment

昆山Automatic silicon wafer invisible cutting equipment

Model:Laser Grooving LFL-AB1200

Scope of application:MEMS、RFID、Image sensor

Consultation

Introduce

Laser stealth cutting is a cutting method that focuses the laser on the inside of the silicon wafer, forms a modified layer inside the silicon wafer, and divides the workpiece into chips by expanding the adhesive film.

Advantage

01. Anhydrous process

02. No dust

03. Fast cutting speed

04. Zero cutting loss

05. High wafer strength after cutting

06. Direct cutting of ultra-thin round crystals

07. No static electricity is generated during cutting

Parameter


Laser power≥15W(Measured about 18W)
Y-axis of linear motorStroke: 440mmStepping:1umResolution:1um
X-axis of linear motorStroke: 700mmStepping:1umResolution:1um
Z axisStroke: 20mmStepping:1umResolution:1um
θ axisStroke: 220°Stepping:0.001°Resolution:0.001°
Machining dimensionMaximum 12inch (300mm)
Scribing modeSD implicit cut


Design sketch

全自动硅晶圆隐形切割设备效果图.png

相关标签:硅晶圆

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