Invisible cutting application technology

Stealth cutting is a cutting method that focuses the laser on the inside of the workpiece, forms a modified layer inside the workpiece, and divides the workpiece into chips by expanding the adhesive film


Application

Advantages of invisible cutting

Due to the internal modification of the workpiece, the generation of machining chips can be restrained. It is suitable for workpieces with poor dirt resistance
It is suitable for workpieces with poor load resistance (MEMS, etc.), and adopts dry processing technology without cleaning
The width of the cutting path can be reduced, so it helps to reduce the chip spacing

Processing example of invisible cutting

MEMS cutting

In the cutting of MEMS chip, the chip with complex micro components and the chip with hollow structure are usually not very strong to bear the cleaning water and processing load. The invisible cutting does not use water during processing and cleaning, and basically does no damage to the front and back of the chip. Therefore, it is expected to achieve high-quality MEMS processing.


Reduce the width of the cutting path

Stealth cutting can reduce the width of the cutting path (cutting width). Therefore, compared with the usual cutting, it is expected to increase the number of chips in one chip. The processing method is especially effective for processing strip chips with equal length of linear sensors.

隐形切割后的MEMS照片.jpg

* MEMS photos after invisible cutting


Simulation of chip manufacturing number

An example of increasing the number of long strip chips in a chip by reducing the chip spacing

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Hassen cutting

Hassen cutting is a method of repeatedly switching on and off the laser according to the preset distance in the process of laser cutting. Various shapes can be processed according to different on / off settings.

Hasen切割.jpg

Hassen cutting

Hassen cutting is a method of repeatedly switching on and off the laser according to the preset distance in the process of laser cutting. Various shapes can be processed according to different on / off settings.

Hasen切割.jpg

Chip segmentation through die separator device

Die separator is a device for chip segmentation of wafers that generate deterioration layers inside after invisible cutting by expanding the cutting tape. Firstly, the invisible cut wafer is placed on the expansion work disk and divided by the expansion cutting tape. Next, heat shrinking the cutting tape at a high temperature above 200 ℃ on the thermal expansion working disc to eliminate the relaxation around the cutting tape.
Through these, there is no need to replace the rubber film, and the rubber film frame can be directly sent to the next process.

stealth10.jpg

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