太仓Automatic laser slotting / full cutting equipment

太仓Automatic laser slotting / full cutting equipment

Model:Laser Grooving LFL-AB1200

Scope of application:Lowk wafer, Gan wafer, non low k wafer

Consultation

Introduce

With the continuous improvement of chip integration, the linewidth is getting smaller and smaller, and RC delay and crosstalk noise have become prominent problems. When the linewidth required by the process is less than 65nm, lon-k layer with low dielectric constant must be used to solve the above problems. Because it is difficult to use ordinary diamond grinding wheel for cutting, sometimes it can not meet the processing standards required by electronic component manufacturers. Therefore, the engineers of Suzhou radium laser technology Co., Ltd. have developed processing application technology that can solve this problem.

Advantage

01. Double cutting optical path

02. Cutting width 8-70 μ M continuously variable

03. Independently designed optical system

04. High productivity and stability

Parameter


Laser power≥15W(Measured about 18W)
Y-axis of linear motorStroke: 450mmStepping:1umResolution:1um
X-axis of linear motorStroke: 650mmStepping:1umResolution:1um
Z axisStroke: 20mmStepping:1umResolution:1um
θ axisStroke: 270°Stepping:0.001°Resolution:0.001°
Machining dimensionMaximum 12inch (300mm)
Scribing modeFull cut / surface grooving


Design sketch

切割效果.jpg

相关标签:隐形切割设备

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